Substrate bonding machine for liquid crystal display device

ABSTRACT

A substrate bonding device for fabricating a liquid crystal display (LCD) device accurately aligns substrates of the LCD device while preventing the introduction of foreign material into the substrate bonding device, thereby substantially preventing the generation of defects within liquid crystal material of the LCD device.

This application claims the benefit of the Korean Application Nos.P2002-71366, P2002-71368, and P2002-71370, each filed on Nov. 16, 2002,and P2002-71714, filed on Nov. 18, 2002, which is hereby incorporated byreference for all purposes as if fully set forth herein. Thisapplication incorporates by reference two applications, Ser. No.10/184,096, filed on Jun. 28, 2002, entitled “SYSTEM AND METHOD FORMANUFACTURING LIQUID CRYSTAL DISPLAY DEVICES” and Ser. No. 10/184,088,filed on Jun. 28, 2002, entitled “SYSTEM FOR FABRICATING LIQUID CRYSTALDISPLAY AND METHOD OF FABRICATING LIQUID CRYSTAL DISPLAY USING THESAME”, as if fully set forth herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to liquid crystal display (LCD) devices,and more particularly to a substrate bonding device facilitating thefabrication of large-sized LCD devices.

2. Background of the Related Art

With the expansion of the information society, a need has arisen fordisplays capable of producing high quality images in thin, lightweightpackages and that consume little power. To meet such needs, research hasproduced a variety of flat panel display devices, including liquidcrystal displays (LCD), plasma displays (PDP), electro luminescentdisplays (ELD), and vacuum fluorescent displays (VFD). Some of thesedisplay technologies have already been applied in various types ofdisplays.

Of the various types of flat panel display devices, LCD devices, havingexcellent display quality, light weight, thin dimensions, and consuminglow amounts of power, have been very widely used. In fact, in portabledevices, such as notebook PC computers, LCD technology has alreadyreplaced cathode ray tubes (CRT) as the display of choice. Moreover,even in desktop PCs and in TV monitors, LCDs devices are becoming morecommon.

Despite various technical developments in LCD technology, however,research in enhancing the picture quality of LCD devices has beenlacking compared to research in other features and advantages of LCDdevices. Therefore, to increase the use of LCD devices as displays invarious fields of application, LCD devices capable of expressing highquality images (e.g., images having a high resolution and a highluminance) with large-sized screens, while still maintaining a lightweight, minimal dimensions, and low power consumption must be developed.

LCDs are generally fabricated by coating a patterned sealant materialonto one of two substrates, providing the patterned sealant materialwith an injection hole, bonding the two substrates together in a vacuum,and injecting liquid crystal material through the injection hole andinto a space between the two bonded substrates. It has also beensuggested that the liquid crystal material may be provided to LCDs via adispensing method, rather than an injection method. For example,Japanese Laid Open Patent Nos. 2000-284295 and 2001-005405 can beunderstood to disclose a method of dispensing liquid crystal materialwherein, after liquid crystal material is dispensed and sealant materialis coated onto one of the two substrates, the other of the twosubstrates is bonded to the one substrate in a vacuum.

Generally, liquid crystal material dispensing methods are advantageousover liquid crystal material injection methods because they reduce thenumber of fabrication steps required to fabricate LCD panels (e.g.,formation of the liquid crystal injection hole, injection of the liquidcrystal material, sealing of the liquid crystal injection hole, etc.,are omitted), thereby simplifying fabrication of LCD panels.Accordingly, fabricating LCD panels by dispensing liquid crystalmaterial have been the subject of recent research.

FIGS. 1 and 2 illustrate a related art substrate bonding device used infabricating LCD panels formed with dispensed liquid crystal material.

Referring to FIGS. 1 and 2, the related art LCD device substrate bondingdevice is provided with a frame 10, an upper stage 21, a lower stage 22,a sealant dispensing part (not shown), a liquid crystal materialdispensing part 30, an upper chamber unit 31, a lower chamber unit 32,chamber moving means, and stage moving means.

The sealant dispensing part (not shown) and liquid crystal dispensingpart 30 are typically provided at a side portion of the frame 10.Moreover, the upper and lower chamber units 31 and 32, respectively, canbe joined to each other to bond substrates of an LCD panel.

The chamber moving means generally includes a driving motor 40 formoving the lower chamber unit 32 laterally to predetermined positionswhere the substrates are to be bonded (S2) and where the sealantmaterial is to be coated and where the liquid crystal material is to bedispensed (S1). The stage moving means includes a driving motor 50 forraising and lowering the upper stage 21 to predetermined positions.

A method for fabricating an LCD panel using the related art substratebonding device will now be described in greater detail.

A first substrate 51 is positioned on the lower stage 22 of the lowerchamber unit 32 and the chamber moving means 40 moves the lower chamberunit 32 under the upper chamber unit 31 such that the lower stage 22 isbeneath the upper stage 21. Next, the driving motor 50 of the stagemoving means lowers the upper stage 21 to a predetermined position suchthat the first substrate 51 is secured to the lowered upper stage 21.Subsequently, the upper stage 21, to which the first substrate 51 issecured, is raised to a predetermined position. The chamber moving means40 then moves the lower chamber unit 32 to a position where a secondsubstrate 52 is loaded on the lower stage 22. Subsequently, the chambermoving means 40 moves the lower chamber unit 32 to a first predeterminedposition S1 (as shown in FIG. 1). At the first predetermined positionS1, sealant material coating and liquid crystal material dispensingprocesses are applied to the second substrate 52 using the sealantdispensing part (not shown) and the liquid crystal dispensing part 30,respectively. After the coating the sealant material and dispensing theliquid crystal material, the chamber moving means 40 moves the lowerchamber unit 32 to a second predetermined position S2 (as shown in FIG.2) where the first and second substrates 51 and 52, respectively, can bebonded together. Next, the upper and lower chamber units 31 and 32,respectively, are joined to each other such that the upper and lowerstages 21 and 22, respectively, are arranged within an enclosed space. Avacuum is then created within the enclosed space using an evacuatingmeans (not shown). After the vacuum is created, the stage moving means50 lowers the upper stage 21 such that the first substrate 51, securedto the upper stage 21, contacts the second substrate 52 on the lowerstage 22. The upper stage 21 is lowered until the two substrates becomebonded, thereby completing the fabrication of the LCD panel.

Use of the aforementioned related art substrate LCD device substratebonding device is disadvantageous, however, because the overall size ofthe aforementioned related art substrate bonding device is excessivelylarge, especially when designed to fabricate large-sized LCD panels. Theexcessively large overall size of the related substrate bonding devicecreates problems when designing LCD device fabrication processes becausean adequate amount of space must be provided to install the related artsubstrate bonding device while preserving the space in which otherapparatuses of other processes are located.

Further, while the related art bonding device applies sealant and liquidcrystal material to substrates supporting thin film transistors andcolor filter layers and bonds the two substrates together, the relatedart bonding device may increases the overall amount of time required tofabricate one LCD panel. More specifically, because liquid crystalmaterial is dispensed, sealant material is coated, and substrates arebonded all using the same apparatus, substrates transported frompreceding processes must stand idle until the processes performed by therelated art substrate bonding device are complete. Moreover, the overallproductivity of the LCD fabrication process is reduced since the relatedart substrate bonding device cannot process material transported theretowhile other fabrication processes are in progress.

Still further, an imperfect seal can be formed between the joined upperand lower chamber units 31 and 32, respectively. As a result, air mayleak from the external environment into the enclosed space defined bythe upper and lower chamber units and the substrates may become damagedduring bonding, thereby creating a defective bond.

Moreover, a substantially high degree of alignment is required toposition the lower chamber unit 32 and successfully bond the twosubstrates. Such alignment can be extremely difficult and complicatedand unduly lengthen the entire process of fabricating the LCD panel.Accordingly, the many positions the lower chamber 32 is required to moveto (e.g., the first position S1 for dispensing the liquid crystal andcoating the sealant material onto the second substrate 52, the secondposition S2 for bonding the two substrates, etc.) prevent the substratesfrom being properly aligned for a successful bonding.

Additionally, when loading and unloading substrates through the portionof the substrate bonding device, unbonded substrates cannot be loadeduntil the bonded substrates are unloaded. Accordingly, a bottleneck isoften generated in the LCD fabrication line and a substantiallycontinuous process is cannot be established. Accordingly, the overallamount of time required to fabricate and LCD device is increased.

Further, static electricity is generated between various components andforeign materials introduced during the loading of the substrates totheir respective stages. Such static electricity damages the substrates,necessitates frequent cleaning of the stages, and results in a pooryield of the fabrication process.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a substrate bondingdevice for a liquid crystal display device that substantially obviatesone or more of the problems due to limitations and disadvantages of therelated art.

An advantage of the present invention provides a substrate bondingdevice for use in fabricating an LCD device that can reduce the overalltime required to fabricate LCDs while enabling accurate and simplealignment of substrates.

Another advantage of the present invention provides a substrate bondingdevice for use in fabricating an LCD device that enables easy monitoringof a substrate bonding process and a progression of continuous substratebonding.

Yet another advantage of the present invention provides a substratebonding device for use in fabricating an LCD device that substantiallyprevents the introduction of foreign material into a region of thesubstrate bonding device where the substrates are bonded together,prevents generation of static electricity around the substrates, andpromotes smooth bonding processes.

Still another advantage of the present invention provides a substratebonding device for use in fabricating an LCD device that cansubstantially prevent fine particles from sticking to surfaces of thestages and that can substantially prevent the generation of defectswithin the LCD caused by foreign material introduced during a substratebonding process.

Additional features and advantages of the invention will be set forth inthe description which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention. These andother advantages of the invention will be realized and attained by thestructure particularly pointed out in the written description and claimshereof as well as the appended drawings.

To achieve these and other advantages and in accordance with the purposeof the present invention, as embodied and broadly described, a substratebonding device may, for example, include a base frame for providing anouter appearance; a lower chamber unit mounted to the base frame; anupper chamber unit positioned over the lower chamber unit and joinableto the lower chamber unit; chamber moving means mounted to the baseframe for raising and lowering the upper chamber unit; an upper stageand a lower stage provided within interior spaces of the upper and lowerchamber units, respectively, for securing a first substrate and a secondsubstrate, respectively; alignment cameras provided to at least one ofthe upper and lower chamber units for verifying an alignment state ofalignment marks formed on the first and second substrates; and alignmentmeans provided to side surfaces of the lower chamber unit for adjustingrelative positions of the first and second substrates.

In another aspect of the present invention, a substrate bonding devicemay, for example, include a base frame for providing an outerappearance; a lower chamber unit mounted to the base frame; an upperchamber unit positioned over the lower chamber unit and joinable to thelower chamber unit; chamber moving means mounted to the base frame forraising and lowering the upper chamber unit; an upper stage and a lowerstage provided within interior spaces of the upper and lower chamberunits, respectively, for securing a first substrate and a secondsubstrate, respectively; sealing means provided to at least one surfaceof the upper and lower chamber units; and a case for enclosing the upperand lower chamber units, the case having an side portion, wherein anopening is provided in the side portion, through which the substratesmay be inserted.

In a further aspect of the present invention, a substrate bonding devicemay, for example, include a base frame for providing an outerappearance; a lower chamber unit mounted to the base frame; an upperchamber unit positioned over the lower chamber unit and joinable to thelower chamber unit; chamber moving means mounted to the base frame forraising and lowering the upper chamber unit; an upper stage and a lowerstage provided within interior spaces of the upper and lower chamberunits, respectively, for securing a first substrate and a secondsubstrate, respectively; spraying means provided along side portions ofone of the upper and lower chamber units for spraying gas (e.g.,nitrogen, air, etc.) toward sides of the other of the upper and lowerchamber units; blowing means for blowing gas through the spraying means;and a first flow tube having a first end in communication with thespraying means and a second end in communication with the blowing means.

In still a further aspect of the present invention, a method ofprotecting stages in a substrate bonding device may, for example,include positioning a protection sheet over a surface of one of an upperand lower stage; verifying a time during which the protection sheet isreplaced; and rotating first and second reels when the time forreplacing the protection sheet is determined, wherein a used protectionsheet is wound over the first reel and an unused protection sheet iswound off the second reel and over the surface of the one of the upperand lower stage.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention andtogether with the description serve to explain the principles of theinvention.

In the drawings:

FIGS. 1 and 2 illustrate a related art substrate bonding device for usein fabricating LCD panels formed via liquid crystal material dispensingmethods;

FIG. 3 illustrates a substrate bonding device for fabricating LCD panelsin accordance with a first aspect of the present invention in anunloaded state;

FIGS. 4A and 4B illustrate the interior structures of stages within thesubstrate bonding device in accordance with the first aspect of thepresent invention;

FIG. 5 illustrates a plan view of an arrangement of rotatable camswithin the substrate bonding device in accordance with the first aspectof the present invention;

FIG. 6 illustrates a perspective view of support means within thesubstrate bonding device in accordance with the first aspect of thepresent invention;

FIG. 7 schematically illustrates vacuum pumps and pipelines within thesubstrate bonding device in accordance with the first aspect of thepresent invention;

FIG. 8 illustrates the loading of a first substrate within the substratebonding device in accordance with the first aspect of the presentinvention;

FIGS. 9 and 10 illustrate the securing of a first substrate to an upperstage within the substrate bonding device in accordance with the firstaspect of the present invention;

FIGS. 11 to 13 illustrate the loading of a second substrate and thesecuring of the second substrate to a lower stage within the substratebonding device in accordance with the first aspect of the presentinvention;

FIGS. 14, 15A, and 15B illustrate a bonding of the substrates within thesubstrate bonding device in accordance with the first aspect of thepresent invention;

FIGS. 16 to 18 illustrate the alignment of the first and secondsubstrates using the alignment means in accordance with a firstpreferred embodiment of the present invention, schematically;

FIGS. 19A and 19B illustrate the venting process within the substratebonding device in accordance with the first aspect of the presentinvention;

FIG. 20 illustrates a substrate bonding device for fabricating LCDpanels in accordance with a second aspect of the present invention in anunloaded state;

FIG. 21 illustrates the simultaneous loading of unbonded substratesinto, and unloading of bonded substrates out of the substrate bondingdevice in accordance with the second aspect of the present invention;

FIG. 22 illustrates a substrate bonding device for fabricating LCDpanels in accordance with a third aspect of the present invention in anunloaded state;

FIG. 23 illustrates a perspective view of spraying means within thesubstrate bonding device in accordance with the third aspect of thepresent invention;

FIG. 24 illustrates a substrate bonding device for fabricating LCDpanels in accordance with a fourth aspect of the present invention in anunloaded state;

FIGS. 25 to 29 illustrate the process of bonding substrates using thesubstrate bonding device in accordance with the fourth aspect of thepresent invention;

FIGS. 30 and 31 illustrate key parts showing a process for positioning aprotection sheet within the substrate bonding device in accordance withthe fourth aspect of the present invention;

FIG. 32 illustrates the principles of the third aspect of the presentinvention applied to the substrate bonding device in accordance with thesecond aspect of the present invention;

FIG. 33 illustrates the principles of the fourth aspect of the presentinvention applied to the substrate bonding device in accordance with thesecond aspect of the present invention;

FIG. 34 illustrates the principles of the third and fourth aspects ofthe present invention applied to the substrate bonding device inaccordance with the second aspect of the present invention; and

FIG. 35 illustrates the principles of the fourth aspect of the presentinvention applied to the substrate bonding device in accordance with thethird aspect of the present invention.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Reference will now be made in detail to embodiments of the presentinvention, examples of which are illustrated in the accompanyingdrawings.

FIG. 3 illustrates a substrate bonding device for fabricating LCD panelsin accordance with a first aspect of the present invention in anunloaded state.

Referring to generally to FIG. 3, the substrate bonding device inaccordance with the principles of the first aspect of the presentinvention may, for example, include a base frame 100; an upper chamberunit 210; a lower chamber unit 220; chamber moving means (e.g., 310,320, 330, 340, and 350); an upper stage 230; and a lower stage 240;sealing means (e.g., 250); alignment cameras 520; alignment means (e.g.,531, 532, 533, 534, 540, and 541) shown, for example, in FIG. 5; supportmeans (e.g., 710 and 720), shown for example, in FIG. 6; vacuum pumpingmeans (e.g., 610, 621, and 622) shown, for example, in FIG. 7; andinterlocking means (e.g., 510).

In one aspect of the present invention, the base frame 100 may be fixedto a supporting structure or surface (e.g., the ground), may form theexterior appearance of the substrate bonding device, and may supportdifferent components discussed in greater detail below.

In another aspect of the present invention, upper and lower stages 230and 240 may be fixed to the upper chamber unit 210 and the lower chamberunit 220, respectively. As will be described in greater detail below,the upper and lower chamber units 210 and 220 may be selectively joinedto each other to define an interior space.

The upper chamber unit 210 may, for example, include an upper base 211that may be exposed to an external environment and an upper chamberplate 212 immovably attached to a bottom surface of the periphery of theupper base 211. In one aspect of the present invention, the upperchamber plate 212 may be provided as a rectangular rim and define aninterior space within which the upper stage 230 is fixed. Since theupper stage 230 is fixed to the upper chamber unit 210, the upper stagemay be raised and lowered with the upper chamber unit 210. In anotheraspect of the present invention, a first seal member 213 may be arrangedbetween the upper base 211 and the upper chamber plate 212 of the upperchamber unit 210 to seal the interior space defined by the upper chamberplate 212 from the external environment. In one aspect of the presentinvention, the first seal member 213 may be provided as a gasket, ano-ring, or the like, suitable for sealing.

The lower chamber unit 220 may, for example, include a lower base 221fixed to the base frame 100 and a lower chamber plate 222 arranged abovea top surface of the periphery of the lower base 221. In one aspect ofthe present invention, the lower chamber plate 222 maybe provided as arectangular rim and define an interior space within the which the lowerstage 240 is fixed. In another aspect of the present invention the lowerchamber plate 222 may be movable in left, right, forward, and backward(i.e., lateral) directions with respect to the lower base 221. Inanother aspect of the present invention, the lower chamber unit 220 mayinclude a fixing plate 223 for fixing the lower base 221 to the baseframe 100. In yet another aspect of the present invention, a second sealmember 224 may be arranged between the lower base 221 and the lowerchamber plate 222 of the lower chamber unit 220 and may seal theinterior space defined by the lower chamber plate 222 from a theexternal environment. In one aspect of the present invention, the secondseal member 224 may be provided as a gasket, an O-ring, or the like,suitable for sealing.

According to the principles of the present invention, at least onesupport part 225 may be arranged between the lower base 221 and thelower chamber plate 222 for maintaining the lower chamber plate 222 apredetermined a distance from the upper surface of the lower base 221.The support part 225 may include a first end attached to a bottomportion of the lower chamber plate 222 and a second end that is movablein lateral directions with respect to the lower base 221 and is attachedto a piece that is attached to a bottom portion of the lower base 221.Accordingly, the support part 225 enables the lower chamber plate 222 tomove in left, right, forward, and backward directions relative to thelower base 221.

Referring still to FIG. 3, the aforementioned chamber moving means may,for example, include a driving motor 310 fixed to the base frame 100, adriving shaft 320 coupled to the driving motor 310, a connecting shaft330 arranged substantially perpendicular to the driving shaft 320 forreceiving a driving force from the driving shaft 320, a connecting part340 for connecting the driving shaft 320 to the connecting shaft 330,and a jack part 350 mounted at an end of the connecting shaft 330.

In one aspect of the present invention, the driving motor 310 may bearranged within an interior bottom portion of the base frame 100 and maybe provided as a bilateral shaft motor, having shafts horizontallyprojecting from both sides of the driving motor 310. The driving shaft320 may be connected to the driving motor 310 and transmit drivingforces along a horizontal direction to the connecting part 340 while theconnecting shaft 330 may be connected to the connecting part 340 totransmit the driving force along a vertical direction with respect tothe driving shaft 320. The jack part 350 may be provided at the end ofthe connecting shaft 330, may be connected to the upper chamber unit210, and may include a nut housing to move the upper chamber unit 210upwardly and downwardly, depending on a rotation direction of rotationof the connecting shaft 330. The connecting part 340 may be provided asa system of bevel gears to translate a rotational force supplied fromthe driving shaft 320 along a horizontal direction into a verticalrotational force to the connecting shaft 330.

According to the principles of the present invention, the upper andlower stages 230 and 240, respectively, may each include a fixing plate231 and 241, respectively, fixed to a respective one of the upperchamber unit 210 and the lower chamber unit 220; a securing plate 232and 242, respectively, for securing the first and second substrates; anda plurality of fixing blocks 233 and 243, respectively, arranged betweenrespective pairs of the fixing plates 231 and 241 and the securingplates 232 and 242. In one aspect of the present invention, the securingplates 232 and 242 may each be provided as an electrostatic chuck (ESC)formed of a material such as polyimide for securing a substrate to arespective one of the stages by applying an electrostatic charge.

FIGS. 4A and 4B illustrate the interior structures of stages within thesubstrate bonding device in accordance with the principles of thepresent invention.

FIGS. 4A and 4B illustrate enlarged sectional views of “A” and “B”regions, respectively, shown in FIG. 3. Accordingly, and while referringto FIGS. 4A and 4B, each of the securing plates 232 and 242 may, forexample, additionally include a plurality of holes 232 a and 242 a,respectively, for transmitting a suction force to secure respective onesof the substrates. Accordingly, each of the plurality of holes 232 a and242 a may be in communication with a respective one of a vacuum pipeline271 and 272, respectively, formed within a respective one of the upperstage 230 and lower stage 240. In one aspect of the present invention,each vacuum pipeline 271 and 272 may be connected to a vacuum pump means(e.g., 622, as shown in FIG. 7) for generating the suction force.

Referring back to FIG. 3, the sealing means 250 (hereinafter referred toas a third seal member) may be provided as an O-ring, formed of amaterial such as rubber, and fitted along a top surface of the lowerchamber plate 222 of the lower chamber unit 220. In one aspect of thepresent invention, the third seal member 250 may project from the topsurface of the lower chamber plate 222 to a predetermined height and beformed to a predetermined thickness sufficient to prevent substrates,secured by respective ones of the upper and lower stages 230 and 240,from becoming proximately arranged next to each other upon initiallyjoining the upper and lower chamber units 210 and 220, as will bediscussed in greater detail below. In another aspect of the presentinvention, the thickness of the third seal member 250 may be sufficientto permit the substrates to contact each other when the third sealmember 250 is compressed.

According to the principles of the present invention, the aforementionedalignment means may be used to align substrates 110 and 120 secured toupper and lower stages 230 and 240, respectively. In one aspect of thepresent invention, the alignment means may be coupled to the lowerchamber unit 220 and, during alignment of the substrates 110 and 120,the lower stage 240 may be kept substantially stationary while theposition of the upper stage 230 is adjusted in accordance with theposition of the lower chamber plate 222, adjustable with the alignmentmeans. In one aspect of the present invention, the alignment means may,for example, include a plurality of cams 531, 532, 533, and 534 and stepmotors 540 connected to shafts 541 for driving the cams 531, 532, 533,and 534.

FIG. 5 illustrates a plan view of an arrangement of the rotatable camsin the substrate bonding device in accordance with the principles of thepresent invention.

Referring to FIGS. 3 and 5, each of the cams 531, 532, 533, and 534 maybe rotatably arranged to selectively contact a peripheral surface of thelower chamber plate 222. In one aspect of the present invention, thecams 531, 532,533, and 534 may be arranged substantially symmetricallyalong each of the peripheral surfaces of the lower chamber plate 222. Inanother aspect of the present invention, each of the cams may beeccentrically rotatable such that, upon rotating, the lower chamberplate 222 may be pushed in a predetermined direction. In accordance withthe principles of the present invention, the lower chamber unit may bedefined by four sides, wherein a first pair of opposing sides may belonger than a second pair of opposing sides. Accordingly, two cams maybe rotatably arranged to selectively contact each side of the first pairof opposing sides and one cam may be arranged to selectively contact amiddle portion of each side of the second pair of opposing sides suchthat the lower chamber plate 222 may be movable in the left, right,forward, and backward directions. In one aspect of the presentinvention, each of the cams 531 532, 533, and 534 may rotatesubstantially in unison to push the lower chamber plate 222 along apredetermined direction. For example, if first cams 531 are rotated topush the lower chamber plate 222 along a predetermined direction, thesecond cams 532, arranged opposite the first cams 531, and the third andfourth cams 533 and 534, respectively, arranged adjacent the first cams531, may all rotate substantially in unison such that the lower chamberplate 222 is pushed along the predetermined direction. According to theprinciples of the present invention, a distance between surfaces ofoppositely arranged cams (e.g., 531 and 532 or 533 and 534) may remainsubstantially constant (e.g., the length or width of the lower chamberplate 222).

According to the principles of the present invention, the interlockingmeans 510 may, for example, includes a plurality of holes 222 a providedin the lower chamber plates 222 of the lower chamber unit 220, and aplurality of linear actuators 511 fixed along a periphery of the upperchamber unit 210 for lowering corresponding ones of the plurality ofmovable shafts 512 until the movable shafts 512 are received withinrespective ones of the holes 222 a.

FIG. 6 illustrates a perspective view of support means within thesubstrate bonding device in accordance with the first aspect of thepresent invention.

Referring to FIGS. 3 and 6, the support means may, for example, includea lift pin 710 and a plurality of actuators 720. In one aspect of thepresent invention, the lift pin 710 may have a thickness sufficient tosupport at least one substrate while substantially preventing the atleast one substrate from sagging. A central region of the lift pin 710may include a downwardly bent portion for allowing a loader 910 tosupport the at least one substrate without interfering with the lift pin710. Moreover, portions of the lift pin 710 may be raised through thelower stage 240 and above the upper surface of the lower stage 240 tofacilitate the safe seating of the substrate 120 as it is loaded ontothe lower stage 240. In one aspect of the present invention, when asubstrate is not loaded onto the lower stage 240, a top surface of thelift pin 710 may be positioned below the top surface of the lower stage240. In another aspect of the present invention, a plurality ofactuators 720 may raise and lower the lift pin 710 as required.Accordingly, the support means may facilitate the unloading of thebonded and unbonded substrates seated on the lower stage 240 (see, forexample FIG. 21).

FIG. 7 schematically illustrates vacuum pumps and pipelines within thesubstrate bonding device in accordance with the first aspect of thepresent invention.

Referring to FIGS. 3 and 7, the aforementioned vacuum pumping means 610,621, and 622 may be provided to at least one of the upper and lowerchamber units 210 and 220 and may evacuate the sealed interior spacedefined by the upper and lower chamber units 210 and 220 joinedtogether. In one aspect of the present invention, the vacuum pumpingmeans 610, 621, and 622 may, for example, include a high vacuum pump(Turbo Molecular Pump, “TMP”) 610 and a first and second low vacuum pump(Dry-Pump) 621 and 622, respectively.

The first low vacuum pump 621 may be connected to a high vacuum chamberpipeline 630 provided at a central region of the upper chamber unit 210and enable the high vacuum pump 610 and the interior spaces defined bythe upper and lower chamber plates 212 and 222 to be in communicationwith each other. Moreover, the first low vacuum pump may evacuate thesealed interior space, definable by the upper and lower chamber units210 and 220 to a predetermined pressure.

The second low vacuum pump 622 may be connected to low vacuum chamberpipelines 641 and 642 passing through side regions of the upper andlower chamber units 210 and 220. Further, the second low vacuum pump 622may be connected to pipelines in the upper and lower stages 230 and 240and to a substrate securing pipeline 650 connected to the vacuumpipelines 271 and 272 in the stages 230 and 240, respectively, forsecuring the substrates using a suction force. The pipelines 630, 641,642, and 650 may include at least one shut off valve 661, 662, 663, 664,665, 666, 667, 668, and 669. The high pressure vacuum pipeline 630 mayinclude a pressure sensor 670 for measuring a pressure inside of theinterior spaces the substrates are held therein.

As will be discussed in greater detail below, the low vacuum chamberpipelines 641 and 642 and the substrate securing pipeline 650, incommunication with the second low vacuum pump 622, may be used aspipelines for venting. Accordingly, a gas such as nitrogen (N₂) may beinjected into the sealed interior space definable by the upper and lowerchamber units 210 and 220 for returning a pressure therein from a vacuumstate to an atmospheric pressure.

Referring back to FIG. 3, a plurality of alignment cameras 520 may bemounted within at least one of the upper and lower chamber units 210 and220, respectively, such that alignment marks (not shown) formed on thesubstrates (not shown), secured by the upper or lower stages 230 or 240,may be observed through at least one of the upper chamber unit 210 andthe lower chamber unit 220.

A method for fabricating an LCD device using the substrate bondingdevice shown in FIGS. 3 to 7 will now be described in greater detailwith reference to FIGS. 8 to 19B.

The substrate bonding device may first be provided in the unloaded stateas shown in FIG. 3. Subsequently, a first substrate 110 may be broughtinto a space between the upper and lower chamber units 210 and 220,respectively, via a loader 910.

Next, and while referring to FIG. 9, the upper chamber unit 210 may belowered from its original position such that the upper stage 230 isarranged proximate the first substrate 110. The first substrate 110 maythen become secured to the upper stage 230 by a suction force generatedby the second low vacuum pump 622 and by an electrostatic charge (ESC)generated by the securing plate 232.

Referring now to FIG. 10, after the first substrate 110 has been securedto the upper stage 230, the upper chamber unit 210 may be raised to itsoriginal position and the loader 910 may be removed from the substratebonding device.

Next, and with reference to FIG. 11, the loader 910 may be re-insertedinserted into the substrate bonding device while supporting the secondsubstrate 120. Upon loading the second substrate 120 into the substratebonding device, the lift pin 710 may be raised from its originalposition, through the lower stage 230 and from below the upper surfaceof the lower stage 230, to push the second substrate 120 away from theloader 910. Accordingly, the lift pin 710 may support the secondsubstrate 120 at a predetermined height above the loader 910 (as shownin FIG. 12). When the second substrate 120 is supported at thepredetermined height, the loader 910 may be removed from the substratebonding device. Next, the lift pin 710 may be lowered such that thesecond substrate 120 rests on, and is supported by, the lower stage 240.When the second substrate 120 is supported by the lower stage 240, thesecond substrate 120 may be secured to the lower stage 240 using suctionforces and electrostatic charges. When the first and second substrates110 and 120 are secured to their respective stages 230 and 240, loadingof the substrate bonding device is complete.

Referring now to FIG. 13, after loading of the substrate bonding deviceis complete, the driving motor 310 of the chamber moving means mayrotate the driving shafts 320 and the connecting shafts 330 to lower thejack parts 350 from their original positions. In one aspect of thepresent invention, the upper chamber unit 210 is lowered as the jackparts 350 are lowered from their original positions. Further, the linearactuators 511 may lower the plurality of movable shafts 512 such thatthe moveable shafts 512 project to a predetermined height from thebottom surface of the upper chamber plate 212.

Referring to FIG. 14, as a result of the lowering of the upper chamberunit 210 and of the projection of the moveable shafts 512, the endportions of the moveable shafts 512 may be received within, and contactinterior surfaces of respective ones of the holes 222 a formed in thelower chamber plate 222. In the event that, for example, the upperchamber unit 210 is not substantially level with respect to the lowerchamber unit 220, the movable shafts 512 may contact the interiorsurfaces of the holes 222 a in succession. As the end portions of themoveable shafts 512 are received within the holes 222 a, the chambermoving means moves the upper chamber unit 210 downwardly such that abottom surface of the upper chamber plate 212 contacts a top surface ofthe third sealing member 250, fitted to a periphery of the lower chamberplate 222.

Referring now to FIG. 16, as the jack parts 350 are lowered further,they move out from between the upper chamber unit 210 the lower chamberunit 220 such that a sealed interior space, defined by the upper andlower chamber units 210 and 220 is created, wherein the sealed interiorspace is substantially sealed from the external environment due to theweight of the upper chamber unit 210 pressing upon the third seal member250. Therefore, the first and second substrates 110 and 120 may besubstantially isolated from the external environment.

It one aspect of the present invention the first and second substrates110 and 120, arranged within sealed interior spaced defined by thejoined upper and lower chamber units, may be partially bonded to eachother but separated from each other by an initial distance of a fewhundred microns. By partially bonding, the relative positions of thefirst and second substrates 110 and 120 may be adjusted in a subsequentalignment process. After the alignment process is complete, thesubstrate may be bonded together in a subsequent venting process, aswill be discussed in greater detail below. In one aspect of the presentinvention, the distance between the upper chamber unit 210 and the lowerchamber unit 220 (and therefore the gap between the substrates) may bedetermined by the gap determining sensor 920.

Once created, the sealed interior space defined by the upper and lowerchamber units 210 and 220 is evacuated. Accordingly, the first andsecond low vacuum pumps 621 and 622 may be activated to evacuate thesealed interior space to a first pressure, measured by the pressuresensor 670. After it is determined that the first and second low vacuumpumps 621 and 622 have evacuated the interior space to the firstpressure, the high vacuum pump 610 may be activated to substantiallyevacuate the interior space.

In one aspect of the present invention, the high and first low vacuumpumps 610 and 621 may be connected to the same pipeline 630. Therefore,the first low vacuum pump 621 may be deactivated when the high vacuumpump 610 is activated. After the interior space is substantiallyevacuated, the first and second substrates 110 and 120, arranged withinthe evacuated, sealed interior space may be aligned by the alignmentmeans and the alignment cameras 520.

According to the principles of the present invention, the alignmentcameras 520 may observe alignment marks (not shown) formed on the firstand second substrates 110 and 120 and may verify positional deviationsbetween the alignment marks on the substrates 110 and 120. The verifiedpositional deviations may include distances the upper stage is requiredto move in order to be properly aligned. Accordingly, the distances theupper stage 230 is required to move to be properly aligned may becalculated with reference to the verified deviations.

According to the principles of the present invention, the lower stage240 is fixed to a top surface of the lower base 221. Accordingly, theposition of the lower chamber plate 222 with respect to the lower stage240 may be adjusted. Since the upper stage 230 does not move withrespect to the upper chamber plate 212, the upper stage 230 moves insubstantial unison with the movement of the lower chamber plate 222 viathe interlocking means 510. Therefore, to adjust the alignment of thefirst and second substrates 110 and 120, fixed to their respectivestages 230 and 240, the motion of the lower chamber plate 222, generatedby the alignment means (e.g., rotation of the cams 531, 532, 533, and534 at the peripheral surfaces of the lower chamber plate 222), may betranslated through the interlocking means 510 to the upper stage 230,fixed to the upper chamber unit 210.

In one aspect of the present invention, the degree and direction thecams rotate may be based on the calculated distance the upper stage isrequired to move to be properly aligned. Accordingly, step motors 540,eccentrically fixed the cams via cam shafts 541, may rotate the cams asrequired. According to the principles of the present invention, the cams531, 532, 533, and 534 may be rotatably arranged to selectively contacta peripheral surface of the lower chamber plate 222.

Referring now to FIG. 17, upon verifying a positional deviation betweenthe first and second substrates 110 and 120 using the alignment cameras520, it may determined, for example, that the first substrate 110 has a2 mm deviation in a rear direction and 2 mm deviation in a leftdirection with respect to the second substrate 120, the upper chamberunit 210, having the upper stage 230 fixed thereto, may then be moved by2 mm in a front direction and 2 mm in a right direction using theaforementioned alignment means. Accordingly, the first and secondsubstrates may be accurately aligned while they are secured by theirrespective stages 230 and 240.

With reference to FIG. 18, the aforementioned exemplary positionaldeviation may be corrected by eccentrically rotating the cams 531, 532,533, and 534 contacting the lower chamber plate 222 to a predetermineddegree and in a predetermined manner. For example, the first cams 531,arranged at a rear peripheral surface of the lower chamber plate 222 maybe eccentrically rotated such that lower chamber plate is moved forwardwhile the second cams 532, arranged at a front peripheral surface of thelower chamber plate 222, are eccentrically rotated such that the secondcams 532 and the front peripheral surface of the lower chamber plate 222are separated by a predetermined distance. Further, the third cam 533,arranged at the left peripheral surface of the lower chamber plate 222,may be eccentrically rotated such that the lower chamber plate 222 ismoved to the right while the fourth cam 534, arranged at the rightperipheral surface of the lower chamber plate 222, is eccentricallyrotated such that the fourth cam and the right peripheral surface of thelower chamber plate are separated by a predetermined distance. It isreadily appreciated that the principles of the present invention may beapplied to correct substantially any positional deviation between thesubstrates, wherein rotational amounts and directions of individual onesof the cams may be selectively controlled to move the lower chamberplate 222 in front, rear, left, and right directions eitherconsecutively or simultaneously (e.g., to move the lower chamber plate222 in diagonal directions).

According to the principles of the present invention, the motionimparted by alignment means to the lower chamber plate 222 is translatedthrough the interlocking means 510 to the upper chamber unit. After thepositional deviations have been corrected by the alignment means, thefirst and second substrates 110 and 120 are substantially aligned.Accordingly, the principles of the present invention provide the lowerchamber plate 222, the upper chamber unit 210, the upper stage 230, andthe upper substrate 110 to move substantially as a single body,independent of the lower stage 240. Therefore, a smooth and precisepositional alignment of the first and second substrates, secured bytheir respective stages 230 and 240, may be obtained.

According to the principles of the present invention, the first andsubstrates 110 and 120 may be aligned more than once depending on thetype of alignment marks that are formed on the substrates. For example,if two types of alignment marks are formed on the first and secondsubstrates (e.g., rough alignment marks and fine alignment marks), twoalignment processes may need to be performed, wherein the roughalignment marks are aligned in a rough alignment process before the finealignment marks are aligned in a fine alignment process.

When the rough alignment process is performed, the first substrate 110may be spaced apart from the second substrate 120 by approximately 500μm to approximately 800 μm. In one aspect of the present invention, thefirst substrate 110 may be spaced apart from the second substrate 120 byapproximately 650 μm during the rough alignment process, as shown inFIG. 15A. When the fine alignment process is performed, the firstsubstrate 110 may be spaced apart from the second substrate 120 byapproximately 100 μm to approximately 250 μm. In one aspect of thepresent invention, the first substrate 110 may be spaced apart from thesecond substrate 120 by approximately 150 μm during the fine alignmentprocess, as shown in FIG. 15B.

FIGS. 19A and 19B illustrate the venting process within the substratebonding device in accordance with the first aspect of the presentinvention.

FIG. 19B illustrates an enlarged sectional view of the region “D” shownin FIG. 19A. Accordingly, and while referring now to FIGS. 19A and 19B,after the first and second substrates 110 and 120 have beensubstantially aligned, a power applied to the upper stage 230 generatingthe electrostatic charge, may be turned off and the sealed interiorspace defined by the upper and lower chamber units, within which thealigned first and second substrates are arranged, may be vented.

According to the principles of the present invention, the venting may beperformed by injecting a gas such as nitrogen (N₂) into the sealedinterior space via the low vacuum pipelines 641 and 642 connected to thesecond low vacuum pump 622 through the upper and lower stages 230 and240 to increase pressure within the sealed interior space to anatmospheric pressure. Due to the pressure of the injected gas blowing inthrough the upper stage 230, the first substrate 110, previously securedby the upper stage 230, moves away from the upper stage 230 and becomesbonded to the second substrate 120. As the venting progresses, thepressure within the sealed interior space increases while the pressurebetween the bonded substrates remains substantially in a vacuum state.Due to the difference in pressure between the interior of the bondedsubstrates and the pressure within the sealed interior space, the twosubstrates 110 and 120 may become fully bonded to each other and thedistance between the first and second substrates 110 and 120 decreases.

After the venting is complete, the bonded substrates 110 and 120 mayunloaded wherein, after the bonded substrates are unloaded, theaforementioned processes may be repeated to bond other substratestogether.

Side portions of substrate bonding device described above, withreference to the first aspect of the present invention, are open to theexternal environment. Therefore, foreign material may be unintentionallyand deleteriously introduced into the upper and lower stages 230 and 240and into a space between the first and second substrates. Such foreignmaterial may degrade the quality of the liquid crystal material.Accordingly, a substrate bonding device capable of preventing suchforeign material from being introduced may be beneficial.

Therefore, and in accordance with the principles of a second aspect ofthe present invention, a substrate bonding device may be providedwherein foreign material from the external environment is substantiallyprevented from being introduced either on the stages, on the substrates,or otherwise between the upper and lower chamber units. For example, thesubstrate bonding device of the second aspect of the present inventionmay be provided with a case for enclosing the substrate bonding deviceof the first aspect of the present invention and sealing the substratebonding device of the first aspect of the present invention from theexternal environment.

FIG. 20 illustrates a substrate bonding device for fabricating LCDpanels in accordance with the second aspect of the present invention inan unloaded state.

Referring to FIG. 20, side surfaces of the case 400 may be provided withfirst and second openings 410 and 420, respectively, through which thefirst and substrates 110 and 120 may be loaded into and unloaded fromthe substrate bonding machine. Further, the case 400 may substantiallyenclose surroundings between the upper chamber unit 210 and lowerchamber unit 220 to substantially prevent foreign material from beingintroduced between the chamber units 210 and 220.

In one aspect of the present invention, a portion of the case 400proximate the upper and lower chamber units 210 and 220 may be formedout of a transparent material to facilitate observing at least theprogression of the bonding of the substrates 110 and 120. In anotheraspect of the present invention, a portion of the case 400 proximate theupper and lower stages 230 and 240 may be formed out of a transparentmaterial. Accordingly, the portion of the case 400 formed out of thetransparent material may be provided as observation windows, or thelike. In yet another aspect of the present invention, the entire case400 may be formed of a transparent material. In one aspect of thepresent invention, the case 400 may be formed to enclose only a part ofthe upper and lower chamber units 210 and 220 (e.g., only an upper partof the base frame 100, as shown in FIG. 20) or may enclose substantiallythe entire substrate bonding device.

Referring to FIG. 21, by providing the first and second openings 410 and420, substrates may be loaded into and unloaded from the substratebonding device substantially simultaneously. In one aspect of thepresent invention, the first opening 410 may be arranged within the case400 and opposite the second opening 420. In another aspect of thepresent invention, unbonded substrates (e.g., first or secondsubstrates) may be loaded into the substrate bonding device via thefirst opening 410. In yet another aspect of the present invention,bonded substrates may be unloaded from the substrate bonding device viathe second opening 420. In still another aspect of the presentinvention, a first loader 910 may load unbonded substrates into thesubstrate bonding device through the first opening 410. In yet anotheraspect of the present invention, a second loader 920, different from thefirst loader 910, may unload bonded substrates from the substratebonding device through the second opening 420.

According to the principles of the present invention, the openings 410and 420 may be provided with doors (not shown) for closing the openingsduring progression of the aforementioned substrate bonding processes.

Accordingly, substrate bonding device of the second aspect of thepresent invention may advantageously prevent the introduction of foreignmaterial between the substrates while enabling the bonding process to beviewed.

FIG. 23 illustrates a perspective view of spraying means within thesubstrate bonding device in accordance with the third aspect of thepresent invention.

Referring to FIGS. 22 and 23, the substrate bonding device in accordancewith the principles of the third aspect of the present invention may beprovided with the substrate bonding device of the first aspect of thepresent invention and further include spraying means, blowing means, anda first flow passage 840 to substantially prevent the introduction offoreign material.

In one aspect of the present invention, the spraying means may bemounted to the upper chamber unit 210 and may spray a gas such asnitrogen, air, or the like, to side portions of the lower chamber unit220. The spraying means may further include an ionizer for emitting ionsto side portions of the lower chamber unit 220. Accordingly, the ionsemitted by the ionizer may include ions generated from the sprayed gasand may substantially prevent the generation of unwanted staticelectricity within the substrate bonding device. Consequently, damage tothe substrates caused by static electricity may be substantiallyprevented using the ionizer.

According to the principles of the third aspect of the presentinvention, a peripheral portion of the lower chamber plate 222 may, forexample, include an outwardly sloped surface 226 for discharging gassprayed through first spraying holes 811 to outside the chamber units210 and 220. In one aspect of the present invention, the sloped surface226 may comprise a curved surface, sloping downward toward the edges ofthe lower chamber plate 222 such that the edges of the lower chamberplate 222 are thinner than interior regions of the lower chamber plate222. In another aspect of the present invention, the sloped surface 226may smoothly deflect the sprayed gas while minimizing the degree towhich the gas is turbulently deflected. The first flow tube 840 mayinclude a first end in communication with a second flow tube 810 and asecond end in communication with a fan 831.

In one aspect of the present invention, the blowing means may includethe fan 831 and a fan motor 832 for driving the fan 831.

According to the principles of the present invention, the ionizer may,for example, include a plurality of second spraying holes 812 formed inside surfaces of the second flow tube 810 to direct gas toward thestages 230 and 240 and an ion generating tip 820 arranged proximate eachof the second spraying holes 812. In one aspect of the presentinvention, the ionizer may be formed separately from the spraying means.

A process by which foreign material may be prevented from beingintroduced into the substrate bonding device of the third aspect of thepresent invention will now be described in greater detail below.

Using a controlling part (not shown), the fan motor 832 may be activatedafter the aforementioned substrate bonding process has been initiatedbut prior to completion of the substrate bonding process (e.g., in themiddle of the substrate bonding process). Accordingly, the activated fanmotor may rotate the fan 831 to thus blow the gas through the first flowtube 840. Next, the blown gas becomes introduced into the second flowtube 810 via the first flow tube 840, passes through the first sprayingholes 811 in the second flow tube 810, and is sprayed toward the slopedsurface 226 of the lower chamber plate 222. Subsequently, the sprayedgas flows onto the sloped surface 226 and becomes deflected anddischarged outside the lower chamber unit 220 to thereby prevent theintroduction of foreign material into a space between the chamber units210 and 220.

In one aspect of the present invention, the sprayed gas may be ionized.Accordingly, ions from the sprayed gas may be arranged proximate thestages 230 and 240 to substantially prevent static electricity frombeing generated during bonding of the substrates. In one aspect of thepresent invention, the ions emitted from the ion generating tips 820 anda portion of the gas in the second flow tube 810 passing through thesecond spraying holes 812 may be arranged proximate the stages 230 and240. Accordingly, the generation of unwanted static electricity may beprevented proximate the stages 230 and 240 can be prevented by sprayingthe gas, including the ions, to the stages 230 and 240.

FIG. 24 illustrates a substrate bonding device for fabricating LCDpanels in accordance with a fourth aspect of the present invention in anunloaded state. FIGS. 25 to 29 illustrate the process of bondingsubstrates using the substrate bonding device in accordance with thefourth aspect of the present invention. FIGS. 30 and 31 illustrate aprocess for positioning a protection sheet within the substrate bondingdevice in accordance with the fourth aspect of the present invention.

Referring to FIGS. 24 to 31, the substrate bonding device in accordancewith principles of the fourth aspect of the present invention maysubstantially prevent problems related to the introduction of foreignmaterial accumulated on the stages. For example, when foreign materialaccumulates on the stages, a positional variation on the order of a fewmicrons is generated. Such a positional variation impedes accuratealignment of the substrates. Moreover the foreign material alsogenerates other defects within the LCD. Accordingly, the substratebonding device of the fourth aspect of the present invention may beprovided substantially as the aforementioned substrate bonding device ofthe first aspect, but may further include a first reel 851, a secondreel 852, a protection sheet 860, and a rotating part 870.

In one aspect of the present invention, the first and second reels 851and 852, respectively, may be arranged at opposite side portions of thelower stage 240, fixed in the lower interior space of the lower chamberunit 220. In another aspect of the present invention, the first andsecond reels 851 and 852, respectively, may be arranged at opposite sideportions of the upper stage 230. In yet another aspect of the presentinvention, the first and second reels 851 and 852, respectively, may bearranged at opposite side portions of both the upper and lower stages230 and 240, respectively.

According to the principles of the present invention, the protectionsheet 860 may substantially cover a surface of the lower stage 240 (orof the upper stage 230), wherein opposite ends of the protection sheetmay be wound around the first and second reels 851 and 852 and whereinthe protection sheet 860 may substantially prevent the accumulation offoreign matters on the surface of the lower stage 240 (or upper stage230).

In one aspect of the present invention, the protection sheet 860 may beformed of a material which can transmit an electrostatic chargegenerated by the securing plate 242 (or 232) to the substrates 110 and120 and may include openings corresponding to the plurality of holes 242a (or 232 a) formed in the lower stage 240 (or upper stage 230) andcorresponding to the lift pin 710. Therefore, substantially nointerference may be made between protection sheet 860 and thetransmission of the suction force through the holes 242 a (or 232 a) andthe operation of the lift pin 710 through the lower stage 240.

In one aspect of the present invention, the protection sheet 860 mayinclude a plurality of sheets formed to cover the surface of the lowerstage 240 (or upper stage 230), wherein the plurality of sheets areconnected to each other. Accordingly, a first end of the protectionsheet 860 may be wound around the first reel 851 and a second end of theprotection sheet 860 may be wound around the second reel 852.

The portion of the protection sheet 860 wound around the first reel 851may be provided as an unused protection sheet 860 for use during futuresubstrate bonding processes, while the portion of the protection sheet860 wound around the second reel 852 may be provided as a usedprotection sheet 860 that may be removed from the substrate bondingdevice after substrate bonding processes have been performed. Theportion of the protection sheet 860 arranged over the surface of thestage may be provided as a working protection sheet 860 to be usedduring a present substrate bonding process.

Accordingly, unused portions of the protection sheet 860 wound aroundthe first reel 851 may be scrolled and arranged over a surface of thestage (i.e., a working region) and be used during a substrate bondingprocess. After the substrate bonding process has been performed, theused working protection sheet 860 may be scrolled from the workingregion to the second reel 852, where it may be subsequently discarded.In one aspect of the present invention, the first and second reels 851and 852 may be arranged elevationally lower (or higher) than the surfaceof the lower stage 240 (or the upper stage 230) such that the surface ofthe stage is uniformly and smoothly covered (e.g., such that the portionof the protection sheet 860 is substantially flat over the surface ofthe stage).

According to the principles of the present invention, tension adjustingjigs 880 may be provided adjacent the first and second reels 851 and852. In one aspect of the present invention, the tension adjusting jigs880 may be arranged between each of the reels and the correspondingstage. In another aspect of the present invention, the tension adjustingjigs 880 may be rotatably mounted, mounted vertically (e.g., moveable inup and down directions) with respect to the protection sheet 860, ormounted horizontally (e.g., moveable in left and right directions) withrespect to the protection sheet 860 for maintaining the protection sheet860 in the working region substantially flat.

According to the principles of the present invention, the tensionadjusting jigs 880 may be provided with actuators, step motors, or thelike, for raising or lowering the tension adjusting jigs 880. In oneaspect of the present invention, the tension adjusting jigs 880 mayaccurately position the openings in the protection sheets 860 incorrespondence to the positions of the holes 242 a in the lower stage240 and to the position of the lift pin 710 such that operation of thesubstrate bonding device may proceed while maintaining the protectionsheet 860 in the working region substantially flat.

According to the principles of the present invention, the rotating part870 may rotate the first and second reels 851 and 852 and may beprovided to the second reel 852 only, the first reel 851 only, or boththe first and second reels 851 and 852.

A process for preventing the accumulation of foreign material on thestages using the substrate bonding device of the fourth aspect of thepresent invention will now be described in greater detail below.

Referring to FIG. 24, and prior to bonding the substrates, the rotatingpart 870 may be activated to rotate the second reel 852, wherein theprotection sheet 860 wound around the first reel 851 may be scrolledover the surface of the lower stage 240. Accordingly, the positions ofthe openings in the protection sheet 860 within the working regionsubstantially correspond with positions of the holes 242 a in thesurface of the lower stage 240 and with a position of the lift pin 710.Such correspondence between the openings in the protection sheet 860 andthe other structures in the substrate bonding device may be controlledby, for example, controlling an amount of rotation of the second reel852.

Referring to FIGS. 25 and 26, the first substrate 110 may be loaded bythe loader 910 and secured by the upper stage 230 followed by theloading and securing of the second substrate 120 to the lower stage 240.While the protection sheet 860 is arranged between the lower stage 240and the second substrate 120, the second substrate 120 may be secured tothe top surface of the lower stage 240 because the protection sheet 860is formed of a material capable of transmitting an electrostatic chargeand the holes 242 a in the lower stage 240 are exposed by the holes inthe protection sheet 860.

Next, referring to FIGS. 27 to 29, the substrates, secured to theirrespective stages, may be bonded according to, for example, thesubstrate bonding process described above with respect to the firstaspect of the present invention. After the bonding, the bondedsubstrates may be unloaded from the substrate bonding device and theprocess described above may be repeated.

During the substrate bonding process described above, a controller (notshown) for controlling the substrate bonding device may control thenumber of times the protection sheet 860 has been scrolled from thefirst reel 851 to the working region. In one aspect of the presentinvention, the controller may scroll the protection sheet 860 after apredetermined number of substrates have been bonded. In another aspectof the present invention, the protection sheet 860 may be scrolledaccording to a predetermined time interval, wherein an amount of time ismeasured and wherein the protection sheet 860 is scrolled prior to asubstrate bonding process if the amount of time measured exceeds thepredetermined time interval.

Referring to FIG. 30, the protection sheet 860 may be scrolled bycontrolling the rotating part 870 to rotate the second reel 852 in apredetermined direction wherein the used protection sheet in the workingregion is scrolled and wound around the second reel 852 and an unusedprotection sheet 860 on the first reel part 851 is scrolled over thelower stage 240, to substantially cover the top surface of the lowerstage 240. In order to maintain the protection sheet 860 in the workingregion over the surface of the stage substantially flat, the tensionadjusting jigs 880 are rotated (or raised/lowered, moved in lateraldirections, etc.) when an unused protection sheet 860 is scrolled tocompletely cover the surface of the stage by the rotation of the reels851 and 852.

Accordingly, because positions of the openings in the protection sheet860 substantially correspond to positions of the holes 242 a and thelift pin 710, a continuous fabrication process may be made possiblewhile the generation of defects caused by foreign material may besubstantially prevented.

It will be readily appreciated that the aforementioned principles of thefirst to fourth aspects of the present invention may be combined insubstantially any manner required or may be used individually. Forexample, and with reference to FIG. 32, the gas spraying means and theionizer of the third aspect may be applied to the substrate bondingdevice of the second aspect, wherein the spraying means and the ionizermay be mounted to the upper chamber unit proximate the first and secondopenings 410 and 420, formed in the case 400. Moreover, and withreference to FIG. 33, the first and second reels 851 and 852, theprotection sheet 860, and the rotating part 870 of the fourth aspect maybe applied to the substrate bonding device of the second aspect.Furthermore, and with reference to FIG. 34, the spraying means and theionizer of the third aspect, and the reels 851 and 852, the protectionsheet 860, and the rotating part 870 of the fourth aspect may be appliedto the substrate bonding device of the second aspect. Still further, andwith reference to FIG. 35, the reels 851 and 852, the protection sheet860, and the rotating part 870 of the fourth aspect may be applied tothe substrate bonding device of the third aspect, and the like.

As has been described in accordance with the principles of the presentinvention, the substrate bonding device facilitating the fabrication ofLCD devices formed via a liquid crystal dispensing method isadvantageous the overall size of the substrate bonding device may bereduced compared to related art substrate bonding devices because thesubstrate bonding device of the present invention is not provided withfunctionality to coat sealant material or dispense liquid crystalmaterial onto substrates. Accordingly, the substrate bonding deviceprovides a simplified design and saves space. Moreover, the volume ofthe interior space defined by the upper and lower chamber units may beminimized to thereby reduce the amount of time required to evacuate theinterior space. By reducing the evacuation time, the amount of timerequired to fabricate an LCD device may be reduced. Moreover, asimplified structure may be obtained by using the plurality of rotatablecams to align the substrates by adjusting a position of the lowerchamber unit.

Further, the second to fourth aspects of the present inventionsubstantially protect the space between the chamber units against fromexternal environment via the case. Accordingly, the introduction offoreign material may be substantially prevented, thereby preventing thegeneration of defects with LCD devices.

Moreover, as the substrate bonding device of the second aspect of thepresent invention may permit loading and unloading of the substratethrough opposite sides of the substrate bonding device, and LCDs may bemanufactured according to an in-line process. Accordingly a series ofprocesses (e.g., loading and unloading substrates) may be carried outsubstantially simultaneously to provide a substantially continuousfabrication process and shortening an overall amount of time required tofabricate the LCDs.

Further, the substrate bonding device of the third aspect of the presentinvention may substantially prevent the introduction of foreign materialinto using a continuous spray of gas, separating an interior spacebetween the chamber units from an external environment. In one aspect ofthe present invention, the spray of gas may substantially remove foreignmaterial from loader and from the substrates during the loading of thesubstrates. In another aspect of the present invention, the sprayed gasmay include ions and may be directed proximate the substrates tosubstantially prevent the generation of static electricity when thestages secure the substrates.

Lastly, the substrate bonding device of the fourth aspect of the presentinvention may substantially prevent the accumulation of micron-sizedparticles onto the stages, thereby preventing the generation of defectswithin the LCD caused by the micron-sized particles.

It will be apparent to those skilled in the art that variousmodifications and variation can be made in the present invention withoutdeparting from the spirit or scope of the invention. Thus, it isintended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

1. A substrate bonding device for fabricating a liquid crystal display(LCD) panel, comprising: a base frame: a lower chamber unit mounted tothe base frame, wherein the lower chamber unit defines a lower interiorspace and includes an upper surface; an upper chamber unit arranged overthe lower chamber unit, wherein the upper chamber unit defines an upperinterior space, includes a lower surface, and is joinable to the lowerchamber unit; chamber moving means for raising and lowering the upperchamber unit; an upper stage arranged within the upper interior spacefor securing a first substrate; a lower stage arranged within the lowerinterior space for securing a second substrate; alignment camerasprovided to at least one of the upper and lower chamber units forverifying an alignment state of a plurality alignment marks formed onthe first and second substrates; alignment means arranged at sideportions of the lower chamber unit for adjusting an alignment betweenthe first and second substrates; and interlocking means provided to thechamber units for coupling the upper chamber unit to the lower chamberunit.
 2. The substrate bonding device as claimed in claim 1, wherein theupper chamber unit includes: an upper base exposed to an externalenvironment; and an upper chamber plate attached to the lower surface ata periphery of the upper base.
 3. The device as claimed in claim 2,wherein the upper chamber plate is provided as a rectangular rimdefining the upper interior space within which the upper stage isarranged.
 4. The device as claimed in claim 3, wherein the upper stageis fixed to the upper base.
 5. The substrate bonding device as claimedin claim 1, wherein the lower chamber unit includes: a lower base fixedto the base frame; and a lower chamber plate arranged above the uppersurface at a periphery of the lower base.
 6. The device as claimed inclaim 5, wherein the lower chamber plate is provided as a rectangularrim defining the lower interior space within which the lower stage isarranged.
 7. The device as claimed in claim 5, wherein the lower chamberplate is moveable in lateral directions with respect to the lower base.8. The device as claimed in claim 5, wherein the lower stage is fixed tothe lower base.
 9. The substrate bonding device as claimed in claim 5,wherein the alignment means includes: a plurality of cams rotatablyprovided to selectively contact and push peripheral portions of thelower chamber plate; a plurality of shafts connected to correspondingones of the plurality of cams; and a plurality of motors fixed to thelower base and connected to corresponding ones of the plurality of camsfor rotating the plurality of cams via corresponding ones of theplurality of shafts.
 10. The substrate bonding device as claimed inclaim 9, wherein each of the plurality of shafts are eccentricallyconnected to corresponding ones of the plurality cams.
 11. The substratebonding device as claimed in claim 9, wherein each of the plurality ofmotors include a step motor.
 12. The substrate bonding device as claimedin claim 9, wherein the lower chamber unit includes a first pair ofopposing sides and a second pair of opposing sides, wherein a length ofthe first pair of opposing sides is greater than a length of the secondpair of opposing sides; two cams are arranged proximate each side of thefirst pair of opposing sides; and one cam is arranged proximate eachside of the second pair of opposing sides.
 13. The substrate bondingdevice as claimed in claim 12, wherein the cams arranged proximate eachside of the second pair of opposing sides are arranged substantially inthe middle of each side of the second pair of opposing sides.
 14. Thesubstrate bonding device as claimed in claim 12, wherein the camsarranged proximate each side of the first pair of opposing sides arearranged at side portions of each side of the first pair of opposingsides.
 15. The substrate bonding device as claimed in claim 12, whereina distance between oppositely arranged ones of cams remainssubstantially constant upon being rotated.
 16. The substrate bondingdevice as claimed in claim 1, wherein the alignment means is arrangedoutside the lower interior space.
 17. The substrate bonding device asclaimed in claim 1, wherein the interlocking means includes: a pluralityof holes in the upper surface; a plurality of moveable shafts eachhaving a first end and a second end; and a plurality of linear actuatorsfixed to the upper chamber unit and to the first ends of the pluralityof moveable shafts for projecting the second ends of the plurality ofthe movable shafts into a corresponding one of the plurality of holes.18. The substrate bonding device as claimed in claim 1, wherein thechamber moving means includes: a driving motor fixed to the base frame;a driving shaft coupled to the driving motor; a connecting partconnected to the driving shaft; a jack part connected to the upperchamber unit; and a connecting shaft having one end connected to theupper chamber unit, and the other end connected to receive a drivingforce from the driving shaft.
 19. The substrate bonding device asclaimed in claim 1, further comprising a case for enclosing the upperand lower chamber units.
 20. The substrate bonding device as claimed inclaim 19, wherein a side portion of the case includes a first openingfor loading substrates into the substrate bonding device.
 21. Thesubstrate bonding device as claimed in claim 20, wherein a side portionof the case includes a second opening for unloading substrates into thesubstrate bonding device.
 22. The substrate bonding device as claimed inclaim 1, further comprising: spraying means arranged at side portions ofone of the upper and lower chamber units for spraying gas toward sidesof the other one of the upper and lower chamber units; blowing means forblowing the gas through the spraying means; and a first flow tube havinga first end in communication with the spraying means and a second end incommunication with the blowing means.
 23. The substrate bonding deviceas claimed in claim 22, wherein the spraying means includes a secondflow tube arranged at side portions of the upper chamber unit, wherein aplurality of spraying holes are arranged at a bottom portion of thesecond flow tube.
 24. The substrate bonding device as claimed in claim23, wherein the spraying means further includes an ionizer for emittingions.
 25. The substrate bonding device as claimed in claim 24, whereinthe ionizer includes an ion generating tip fitted in front of theplurality of spraying holes in the second flow tube.
 26. The substratebonding device as claimed in claim 22, further comprising an ionizerarranged proximate side portions of one of the upper and lower chamberunits for emitting ions toward side portions of the other one of theupper and lower chamber units.
 27. The substrate bonding device asclaimed in claim 26, wherein the ionizer includes: a flow tube arrangedat side portions of the upper chamber unit, wherein the flow tubeincludes a plurality of spraying holes facing toward the upper and lowerstages, wherein gas is flowable through the plurality of spraying holes;and an ion generating tip arranged proximate a front portion of each ofthe plurality of spraying holes.
 28. The substrate bonding device asclaimed in claim 27, wherein the gas includes nitrogen gas.
 29. Thesubstrate bonding device as claimed in claim 27, wherein foreignmaterial between the upper and lower chamber units is removable by thegas.
 30. The substrate bonding device as claimed in claim 1, furthercomprising a sealing means provided to at least one of the upper andlower surfaces for sealing an interior space surrounding the first andsecond substrates, wherein the sealed interior space is definable byjoined ones of the upper and lower chamber units.
 31. The substratebonding device as claimed in claim 30, wherein the sealing meansincludes an O-ring fitted along the upper surface.
 32. The substratebonding device as claimed in claim 1, further comprising: first andsecond reels arranged at opposite side portions of at least one of theupper and lower stages; a protection sheet for covering a surface of atleast one stage, wherein the protection sheet is scrollable by the firstand second reels; and a rotating part for rotating the first and secondreels.
 33. The substrate bonding device as claimed in claim 32, whereinat least one of the upper and lower stages includes an electrostaticchuck for applying an electrostatic charge to secure a corresponding oneof the first and second substrates.
 34. The substrate bonding device asclaimed in claim 33, wherein the electrostatic chuck includes polyimide.35. The substrate bonding device as claimed in claim 33, wherein theelectrostatic chuck includes a plurality of holes for transmitting asuction force to secure the corresponding one of the first and secondsubstrates.
 36. The substrate bonding device as claimed in claim 33,wherein the electrostatic charge appliable by the electrostatic chuck istransmittable by the protection sheet.
 37. The substrate bonding deviceas claimed in claim 33, wherein the protection sheet includes aplurality of holes.
 38. The substrate bonding device as claimed in claim37, wherein the plurality of holes in the protection sheet arearrangeable to substantially correspond to a plurality of holes in theelectrostatic chuck.
 39. The substrate bonding device as claimed inclaim 32, wherein the first and second reels are arranged elevationallylower than the surface of the lower stage.
 40. The substrate bondingdevice as claimed in claim 32, wherein the first and second reels arearranged elevationally higher than the surface of the upper stage. 41.The substrate bonding device as claimed in claim 32, further comprisingtension adjusting jigs arranged adjacent each of the first and secondreels for maintaining the protection sheet to over the surface of the atleast one stage to be substantially flat.
 42. The substrate bondingdevice as claimed in claim 41, wherein the tension adjusting jigs arerotatably mounted.
 43. The substrate bonding device as claimed in claim41, wherein the tension adjusting jigs are movable in verticaldirections.
 44. The substrate bonding device as claimed in claim 41,wherein the tension adjusting jigs are movable in lateral directions.45. The substrate bonding device as claimed in claim 32, wherein thefirst and second reels are arranged within at least one of the lower andupper interior spaces.
 46. A substrate bonding device for fabricating aliquid crystal display device (LCD), comprising: a base frame; a lowerchamber unit mounted to the base frame, wherein the lower chamber unitdefines a lower interior space and includes an upper surface; an upperchamber unit arranged over the lower chamber unit, wherein the upperchamber unit defines an upper interior space, includes a lower surface,and is joinable to the lower chamber unit; chamber moving means forraising and lowering the upper chamber unit; an upper stage arrangedwithin the upper interior space for securing a first substrate; a lowerstage arranged within the lower interior space for securing a secondsubstrate; a sealing means provided to at least one of the upper andlower surfaces for sealing an interior space surrounding the first andsecond substrates, wherein the sealed interior space is definable byjoined ones of the upper and lower chamber units; and a case forenclosing the upper and lower chamber units, wherein the case includes atransparent material, wherein an inside of the substrate bonding deviceis observable from outside the case through the transparent material.47. The substrate bonding device as claimed in claim 46, wherein thetransparent material includes at least one window for enabling a portionof a substrate bonding process is observable from outside the casethrough the at least one window.
 48. The substrate bonding device asclaimed in claim 46, wherein an entirety of the case includestransparent material.
 49. The substrate bonding device as claimed inclaim 46, wherein the case includes a first opening for loadingsubstrates into the substrate bonding device.
 50. The substrate bondingdevice as claimed in claim 49, wherein the case includes a secondopening for unloading substrates from the substrate bonding device. 51.The substrate bonding device as claimed in claim 50, wherein the firstand second openings are formed in opposing surfaces of the case.
 52. Thesubstrate bonding device as claimed in claim 46, further comprising:spraying means arranged at side portions of one of the upper and lowerchamber units for spraying gas toward sides of the other one of theupper and lower chamber units; blowing means for blowing the gas throughthe spraying means; and a first flow tube having a first end incommunication with the spraying means and a second end in communicationwith the blowing means for transporting the gas from the blowing meansto the spraying means.
 53. The substrate bonding device as claimed inclaim 52, wherein the spraying means includes a second flow tubearranged at side portions of the upper chamber unit, wherein a pluralityof spraying holes are arranged at a bottom portion of the second flowtube.
 54. The substrate bonding device as claimed in claim 53, whereinthe spraying means further includes an ionizer for emitting ions. 55.The substrate bonding device as claimed in claim 54, wherein the ionizerincludes an ion generating tip fitted in front of the plurality ofspraying holes in the second flow tube.
 56. The substrate bonding deviceas claimed in claim 52, wherein a peripheral region of the other one ofthe upper and lower chamber units includes an outwardly sloped surface.57. The substrate bonding device as claimed in claim 56, wherein thesloped surface is curved.
 58. The substrate bonding device as claimed inclaim 52, further comprising an ionizer arranged proximate side portionsof one of the upper and lower chamber units for emitting ions towardside portions of the other one of the upper and lower chamber units. 59.The substrate bonding device as claimed in claim 58, wherein the ionizerincludes: a flow tube arranged at side portions of the upper chamberunit, wherein the flow tube includes a plurality of spraying holesfacing toward the upper and lower stages, wherein gas is flowablethrough the plurality of spraying holes; and an ion generating tiparranged proximate a front portion of each of the plurality of sprayingholes.
 60. The substrate bonding device as claimed in claim 59, whereinthe gas includes nitrogen gas.
 61. The substrate bonding device asclaimed in claim 59, wherein foreign material between the upper andlower chamber units is removable by the gas.
 62. The substrate bondingdevice as claimed in claim 46, further comprising: first and secondreels arranged at opposite side portions of at least one of the upperand lower stages; a protection sheet for covering a surface of at leastone stage, wherein the protection sheet is scrollable by the first andsecond reels; and a rotating part for rotating the first and secondreels.
 63. The substrate bonding device as claimed in claim 62, whereinat least one of the upper and lower stages includes an electrostaticchuck for applying an electrostatic charge to secure a corresponding oneof the first and second substrates.
 64. The substrate bonding device asclaimed in claim 63, wherein the electrostatic chuck includes apolyimide material.
 65. The substrate bonding device as claimed in claim63, wherein the electrostatic chuck includes a plurality of holes fortransmitting a suction force to secure the corresponding one of thefirst and second substrates.
 66. The substrate bonding device as claimedin claim 63, wherein the electrostatic charge appliable by theelectrostatic chuck is transmittable by the protection sheet.
 67. Thesubstrate bonding device as claimed in claim 62, wherein the protectionsheet includes a plurality of holes.
 68. The substrate bonding device asclaimed in claim 67, wherein the plurality of holes in the protectionsheet are arrangeable to substantially correspond to a plurality ofholes in the electrostatic chuck.
 69. The substrate bonding device asclaimed in claim 62, wherein the first and second reels are arrangedelevationally lower than the surface of the lower stage.
 70. Thesubstrate bonding device as claimed in claim 62, wherein the first andsecond reels are arranged elevationally higher than the surface of theupper stage.
 71. The substrate bonding device as claimed in claim 62,further comprising tension adjusting jigs arranged adjacent each of thefirst and second reels for maintaining the protection sheet to cover thesurface of the at least one stage to be substantially flat.
 72. Thesubstrate bonding device as claimed in claim 71, wherein the tensionadjusting jigs are rotatably mounted.
 73. The substrate bonding deviceas claimed in claim 71, wherein the tension adjusting jigs are movablein vertical directions.
 74. The substrate bonding device as claimed inclaim 71, wherein the tension adjusting jigs are movable in lateraldirections.
 75. The substrate bonding device as claimed in claim 62,wherein the first and second reels are arranged within at least one ofthe lower and upper interior spaces.
 76. A substrate bonding device forfabricating a liquid crystal display device (LCD), comprising: a baseframe; a lower chamber unit mounted to the base frame, wherein the lowerchamber unit defines a lower interior space and includes an uppersurface; an upper chamber unit arranged over the lower chamber unit,wherein the upper chamber unit defines an upper interior space, includesa lower surface, and is joinable to the lower chamber unit; chambermoving means for raising and lowering the upper chamber unit; an upperstage arranged within the upper interior space for securing a firstsubstrate; a lower stage arranged within the lower interior space forsecuring a second substrate; spraying means arranged along side portionsof one of the upper and lower chamber units for spraying gas toward sideportions of the other one of the upper and lower chamber units; blowingmeans for blowing the gas through the spraying means; and a first flowtube having a first end in communication with the spraying means and asecond end in communication with the blowing means; wherein a peripheralregion of the other one of the upper and lower chamber units includes anoutwardly sloped surface.
 77. The substrate bonding device as claimed inclaim 76, wherein the spraying means includes a second flow tubearranged at side portions of the upper chamber unit, wherein a pluralityof spraying holes are arranged at a bottom portion of the second flowtube.
 78. The substrate bonding device as claimed in claim 77, whereinthe spraying means further includes an ionizer for emitting ions. 79.The substrate bonding device as claimed in claim 78, wherein the ionizerincludes an ion generating tip fitted in front of the plurality ofspraying holes in the second flow tube.
 80. The substrate bonding deviceas claimed in claim 76, wherein the sloped surface is curved.
 81. Thesubstrate bonding device as claimed in claim 76, further comprising anionizer arranged proximate side portions of one of the upper and lowerchamber units for emitting ions toward side portions of the other one ofthe upper and lower chamber units.
 82. The substrate bonding device asclaimed in claim 81, wherein the ionizer includes: a flow tube arrangedat side portions of the upper chamber unit, wherein the flow tubeincludes a plurality of spraying holes facing toward the upper and lowerstages, wherein gas is flowable through the plurality of spraying holes;and an ion generating tip arranged proximate a front portion of each ofthe plurality of spraying holes.
 83. The substrate bonding device asclaimed in claim 82, wherein the gas includes nitrogen gas.
 84. Thesubstrate bonding device as claimed in claim 82, wherein foreignmaterial between the upper and lower chamber units is removable by thegas.
 85. The substrate bonding device as claimed in claim 79, furthercomprising: first and second reels arranged at opposite side portions ofat least one of the upper and lower stages; a protection sheet forcovering a surface of at least one stage, wherein the protection sheetis scrollable by the first and second reels; and a rotating part forrotating the first and second reels.
 86. The substrate bonding device asclaimed in claim 85, wherein at least one of the upper and lower stagesincludes an electrostatic chuck for applying an electrostatic charge tosecure a corresponding one of the first and second substrates.
 87. Thesubstrate bonding device as claimed in claim 86, wherein theelectrostatic chuck includes a polyimide material.
 88. The substratebonding device as claimed in claim 86, wherein the electrostatic chuckincludes a plurality of holes for transmitting a suction force to securethe corresponding one of the first and second substrates.
 89. Thesubstrate bonding device as claimed in claim 86, wherein theelectrostatic charge appliable by the electrostatic chuck istransmittable by the protection sheet.
 90. The substrate bonding deviceas claimed in claim 86, wherein the protection sheet includes aplurality of holes.
 91. The substrate bonding device as claimed in claim90, wherein the plurality of holes in the protection sheet arearrangeable to substantially correspond to a plurality of holes in theelectrostatic chuck.
 92. The substrate bonding device as claimed inclaim 86, wherein the electrostatic chuck includes a polyimide material.93. The substrate bonding device as claimed in claim 85, wherein thefirst and second reels are arranged elevationally lower than the surfaceof the lower stage.
 94. The substrate bonding device as claimed in claim85, wherein the first and second reels are arranged elevationally higherthan the surface of the upper stage.
 95. The substrate bonding device asclaimed in claim 85, further comprising tension adjusting jigs arrangedadjacent each of the first and second reels for maintaining theprotection sheet to over the surface of the at least one stage to besubstantially flat.
 96. The substrate bonding device as claimed in claim95, wherein the tension adjusting jigs are rotatably mounted.
 97. Thesubstrate bonding device as claimed in claim 95, wherein the tensionadjusting jigs are movable in vertical directions.
 98. The substratebonding device as claimed in claim 95, wherein the tension adjustingjigs are movable in lateral directions.
 99. The substrate bonding deviceas claimed in claim 85, wherein the first and second reels are arrangedelevationally higher than the surface of the upper stage.
 100. Thesubstrate bonding device as claimed in claim 85, wherein the first andsecond reels are arranged within at least one of the lower and upperinterior spaces.
 101. A substrate bonding device for fabricating aliquid crystal display device, comprising: an upper stage for securing afirst substrate of an LCD device; a lower stage for securing a secondsubstrate of the LCD device; first and second reels arranged at oppositeside portions of at least one of the upper and lower stages; aprotection sheet for substantially covering a surface of at least onestage, wherein the protection sheet is scrollable by the first andsecond reels; and a rotating part for rotating the first and secondreels, wherein at least one of the upper and lower stages includes anelectrostatic chuck for applying an electrostatic charge to secure acorresponding one of the first and second substrates, and wherein theprotection sheet includes a plurality of holes.
 102. The substratebonding device as claimed in claim 101, wherein the electrostatic chuckincludes a plurality of holes for transmitting a suction force to securethe corresponding one of the first and second substrates.
 103. Thesubstrate bonding device as claimed in claim 101, wherein theelectrostatic charge appliable by the electrostatic chuck istransmittable by the protection sheet.
 104. The substrate bonding deviceas claimed in claim 101, wherein the plurality of holes in theprotection sheet are arrangeable to substantially correspond to aplurality of holes in the electrostatic chuck.
 105. The substratebonding device as claimed in claim 101, wherein the first and secondreels are arranged elevationally lower than the surface of the lowerstage.
 106. The substrate bonding device as claimed in claim 101,further comprising: a lower chamber unit, wherein the lower chamber unitdefines a lower interior space within which the lower stage is arranged;and an upper chamber unit over the lower chamber unit, wherein the upperchamber unit defines an upper interior space within which the upperstage is arranged, wherein the first and second reels are arrangedwithin at least one of the lower and upper interior spaces.
 107. Thesubstrate bonding device as claimed in claim 101, further comprisingtension adjusting jigs arranged adjacent each of the first and secondreels for maintaining the protection sheet to over the surface of the atleast one stage to be substantially flat.
 108. The substrate bondingdevice as claimed in claim 107, wherein the tension adjusting jigs arerotatably mounted.
 109. The substrate bonding device as claimed in claim107, wherein the tension adjusting jigs are movable in verticaldirections.
 110. The substrate bonding device as claimed in claim 107,wherein the tension adjusting jigs are movable in lateral directions.111. A substrate bonding device for fabricating a liquid crystal displaypanel, comprising: a base frame: a lower chamber unit mounted to thebase frame, wherein the lower chamber unit defines a lower interiorspace and includes an upper surface, and wherein the lower chamber unitincludes a first pair of opposing sides and a second pair of opposingsides, wherein a length of the first pair of opposing sides issubstantially greater than a length of the second pair of opposingsides; an upper chamber unit arranged over the lower chamber unit,wherein the upper chamber unit defines an upper interior space, includesa lower surface, and is joinable to the lower chamber unit; chambermoving means for raising and lowering the upper chamber unit; an upperstage arranged within the upper interior space for securing a firstsubstrate; a lower stage arranged within the lower interior space forsecuring a second substrate; alignment cameras provided to at least oneof the upper and lower chamber units for verifying an alignment state ofa plurality of alignment marks formed on the first and secondsubstrates; alignment means arranged at side portions of the lowerchamber unit for adjusting an alignment between the first and secondsubstrates; interlocking means substantially provided to the chamberunits for coupling the upper chamber unit to the lower chamber unit and;a loader and an unloader located at substantially opposite sides of thebonding device for substantially simultaneous processing of substrates.112. A substrate bonding device for fabricating a liquid crystal displaydevice (LCD), comprising: a base frame; a lower chamber unit mounted tothe base frame, wherein the lower chamber unit defines a lower interiorspace and includes an upper surface, and wherein the lower chamber unitincludes a first pair of opposing sides and a second pair of opposingsides, wherein a length of the first pair of opposing sides issubstantially greater than a length of the second pair of opposingsides; an upper chamber unit arranged over the lower chamber unit,wherein the upper chamber unit defines an upper interior space, includesa lower surface, and is joinable to the lower chamber unit; chambermoving means for raising and lowering the upper chamber unit; an upperstage arranged within the upper interior space for securing a firstsubstrate; a lower stage arranged within the lower interior space forsecuring a second substrate; a sealing means provided to at least one ofthe upper and lower surfaces for sealing an interior space surroundingthe first and second substrates, wherein the sealed interior space isdefinable by joined ones of the upper and lower chamber units; a casefor enclosing the upper and lower chamber units; wherein the caseincludes a transparent material, wherein an inside of the substratebonding device is observable from outside the case through thetransparent material and; a loader and an unloader located atsubstantially opposite sides of the bonding device for substantiallysimultaneous processing of substrates.
 113. A substrate bonding devicefor fabricating a liquid crystal display device (LCD), comprising: abase frame; a lower chamber unit mounted to the base frame, wherein thelower chamber unit defines a lower interior space and includes an uppersurface, and wherein the lower chamber unit includes a first pair ofopposing sides and a second pair of opposing sides, wherein a length ofthe first pair of opposing sides is substantially greater than a lengthof the second pair of opposing sides; an upper chamber unit arrangedover the lower chamber unit, wherein the upper chamber unit defines anupper interior space, includes a lower surface, and is joinable to thelower chamber unit; chamber moving means for raising and lowering theupper chamber unit; an upper stage arranged within the upper interiorspace for securing a first substrate; a lower stage arranged within thelower interior space for securing a second substrate; spraying meansarranged substantially along side portions of one of the upper and lowerchamber units for spraying gas toward side portions of the other one ofthe upper and lower chamber units; blowing means for blowing the gasthrough the spraying means; a first flow tube having a first end incommunication with the spraying means and a second end in communicationwith the blowing means; interlocking means provided to the chamber unitsfor substantially coupling the upper chamber unit to the lower chamberunit; and a loader and an unloader located at substantially oppositesides of the bonding device for substantially simultaneous processing ofsubstrates.